Glass Microprobe With Embedded Silicon Vias For 3d Integration

Chiung-Wen Lin,Chih-Wei Chang,Yu-Tao Lee,Rongshun Chen,Yen-Chung Chang,Weileun Fang
DOI: https://doi.org/10.1109/MEMSYS.2009.4805353
2009-01-01
Abstract:This study presents a novel process to realize glass 2D-microprobe array. The through silicon vias (TSVs) can also be integrated with the glass 2D-microprobe using the micromachining process. The vertical integration of chips containing glass 2D-microprobe array is realized using these silicon TSVs. The 3D-microprobe array and the signal processing IC can be easily implemented after vertical assembly of 2D-microprobe chips using bonding. In application, the 2D glass microprobe is fabricated with a low impedance of 439k Omega at 1kHz; and the neural recording experiment has also been successfully performed on a rat.
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