Abstract:Objective. Recording and stimulating neuronal activity across different brain regions requires interfacing at multiple sites using dedicated tools while tissue reactions at the recording sites often prevent their successful long-term application. This implies the technological challenge of developing complex probe geometries while keeping the overall footprint minimal, and of selecting materials compatible with neural tissue. While the potential of soft materials in reducing tissue response is uncontested, the implantation of these materials is often limited to reliably target neuronal structures across large brain volumes. Approach. We report on the development of a new multi-electrode array exploiting the advantages of soft and stiff materials by combining 7-µm-thin polyimide wings carrying platinum electrodes with a silicon backbone enabling a safe probe implantation. The probe fabrication applies microsystems technologies in combination with a temporal wafer fixation method for rear side processing, i.e. grinding and deep reactive ion etching, of slender probe shanks and electrode wings. The wing-type neural probes are chronically implanted into the entorhinal-hippocampal formation in the mouse for in vivo recordings of freely behaving animals. Main results. Probes comprising the novel wing-type electrodes have been realized and characterized in view of their electrical performance and insertion capability. Chronic electrophysiological in vivo recordings of the entorhinal-hippocampal network in the mouse of up to 104 days demonstrated a stable yield of channels containing identifiable multi-unit and single-unit activity outperforming probes with electrodes residing on a Si backbone. Significance. The innovative fabrication process using a process compatible, temporary wafer bonding allowed to realize new Michigan-style probe arrays. The wing-type probe design enables a precise probe insertion into brain tissue and long-term stable recordings of unit activity due to the application of a stable backbone and 7-µm-thin probe wings provoking locally a minimal tissue response and protruding from the glial scare of the backbone.

Ultrathin, Dual-Sided Silicon Neural Microprobes Realized Using Bcb Bonding And Aluminum Sacrificial Etching

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Integration of silicon-via electrodes with different recording characteristics on a glass microprobe using a glass reflowing process.

Fabrication and Surface-Modification of Implantable Microprobes for Neuroscience Studies

Silk-Backed Structural Optimization of High-Density Flexible Intracortical Neural Probes

Glass microprobe with multi-electrode styles implemented by silicon via structure

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Ultra‐Soft Neural Probe with a Temporary High‐Strength U‐Section Coating by Picosecond Laser Micromachining

Dual Mode Neural Probe with Enhanced Microstructure for Neural Stimulation and Recording

A Biodegradable Porous Silicon and Polymeric Hybrid Probe for Electrical Neural Signal Recording

Flexible, multifunctional neural probe with liquid metal enabled, ultra-large tunable stiffness for deep-brain chemical sensing and agent delivery

Multi-Electrode Styles With Novel Sidewall Electrode On Glass Microprobe Implemented By Si-Via Structure

Fabrication and Characterization of Implantable Silicon Neural Probe with Microfluidic Channels

Reinforced silicon neural microelectrode array fabricated using a commercial MEMS process

Design and fabrication of a polyimide-based microelectrode array: application in neural recording and repeatable electrolytic lesion in rat brain

High-Density Neural Microelectrode Arrays With Complementary Wedge-Shaped 3d Assembly Interfaces For Brain Activity Recording

Miniaturized probe on polymer SU-8 with array of individually addressable microelectrodes for electrochemical analysis in neural and other biological tissues

A Multi-Shank Silk-Backed Parylene Neural Probe for Reliable Chronic Recording

A novel microelectrode array probe integrated with electrophysiology reference electrode for neural recording