Ultra‐Soft Neural Probe with a Temporary High‐Strength U‐Section Coating by Picosecond Laser Micromachining

Xiaoli You,Fanqi Sun,Yuhao Zhou,Minghao Wang,Mengfei Xu,Xichen Yuan,Honglong Chang,Jingquan Liu,Bowen Ji
DOI: https://doi.org/10.1002/tee.23985
IF: 0.923
2024-01-10
IEEJ Transactions on Electrical and Electronic Engineering
Abstract:This paper reports an ultra‐soft neural probe with a temporary high‐strength U‐section coating of polyethylene glycol (PEG) for the first time. Its fabrication is compatible with MEMS processes, and an ultrathin U‐section coating over the probe's back and sidewall is precisely formed by spinning and cold laser cutting. With this novel coating, the probe has both minimized cross‐sectional area and sufficient mechanical strength for low‐invasive penetration into the brain. Besides, the remained ultra‐soft deformable probe after PEG dissolution is expected to be the next generation of neural implants for chronic recording. © 2024 Institute of Electrical Engineers of Japan. Published by Wiley Periodicals LLC.
engineering, electrical & electronic
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