Abstract:The ultra-low dielectric constant (ULK) materials is implemented in the copper/low-k interconnection structures in industry in order to minimize the RC delay and crosstalk noise. The mechanical property of ULK dielectrics is weak compared to traditional dielectrics. So it poses a significant risk to the device reliability, not only in the fabrication process, but also in packaging processes and reliability tests. When using numerical simulations to assess the structural integrity associated with low-k integration, accurate mechanical property of ULK materials is also an important parameter that needed to be measured. In this paper, we present a method of measuring the mechanical properties of ULK materials. This method is suitable for a variety of materials which can be deposited or grown on a silicon substrate. The fabricating processes mainly include lithography, temporary bonding, grinding, Si etching and debonding. In addition, we designed two kinds of test structures. One is with pre-crack, and the other is without pre-crack. Each structure has two kinds of geometry sizes. The tensile test was done by using the in-situ tensiometer apparatus with uniaxial stretching. The stress-strain diagrams of the specimens show an elastic modulus $\mathbf{E=1.2}$ GPa and tensile strength is about 13.5 Mpa for the structure without pre-crack, which is lower than that of bulk low-k material. The samples with two kinds of geometry sizes have similar modulus values which can be converted by the measured results from the diagram. While other specimens show a critical energy release rate ${\mathrm{G}_{\mathrm{c}}=0.25\mathrm{J}/\mathrm{m}^{2}}$ for the structure with pre-crack, which is also lower than that of bulk material. The results illustrate that the ability to resist fracture of low-k thin films is weak. It provides a possible method to measure the mechanical properties of ULK thin films.

Measuring The Elastic Modulus And Ultimate Strength Of Low-K Dielectric Materials By Means Of The Bulge Test

Study of Elastic Modulus and Yield Strength of Polymer Thin Films Using Atomic Force Microscopy

The Mechanical Properties of Electroplated Cu Thin Films Measured by Means of the Bulge Test Technique

Evaluation of Mechanical Properties and Strain Criterion for Realibility Design of Micromachined Polysilicon Thin Films

Elastic Modulus of Nanoporous Alumina Films Through Bulge Test

A Systematic Method for Characterizing the Elastic Properties and Adhesion of a Thin Polymer Membrane

Novel scanning electron microscope bulge test technique integrated with loading function.

Inquire into the method of measuring elastic modulus of polymer and metal films in bulge test

Experimental and Theoretical Study of Young Modulus in Micromachined Polysilicon Films

PECVD Low-Permittivity Organosilicate Glass Coatings: Adhesion, Fracture and Mechanical Properties

Study on the mechanical properties of ultra-low dielectric film by tensile test

Measurement of Elastic Modulus and Residual Stress of Diamond Thin Films

Young's Modulus Characterization of Nano-Level Silicon Nanomembrane

Characterization of the Young's Modulus and Residual Stresses for a Sputtered Silicon Oxynitride Film Using Micro-Structures

Characterization of the Mechanical Properties of Microscale Elastomeric Membranes

Mechanical Properties of Mono-crystalline Silicon Thin Films Measured by Different Methods

Measurement Of Young'S Modulus And Residual Stress Of Micromembranes

Mems/Nems Mechanical Characterization on Different Thin - Film Materials by Scanning along Micro-Machined Cantilevers

A comparative micro-cantilever study of the mechanical behavior of silicon based passivation films

Measurement of Temperature-Dependent Young’s Modulus at a Strain Rate for a Molding Compound by Nanoindentation

Measuring the Young’s Relaxation Modulus of PDMS Using Stress Relaxation Nanoindentation