Abstract:The success of microelectromechanical systems (MEMS) as a key technology in the 21st century depends in no small part on the solution of materials issues associated with the design and fabrication of complex MEMS devices. The reliable mechanical properties of these thin films are critical to the safety and functioning of these microdevices and should be accurately determined. In order to accomplish a reliable mechanical design of MEMS, a new microtensile test device using a magnetic-solenoid force actuator was developed to evaluate the mechanical properties of microfabricated polysilicon thin films with dimensions of 100–660 μm length, 20–200 μm width, and 2.4 μm thickness. It was found that the measured average value of Young’s modulus, 164 ±1.2 GPa, falls within the theoretical bounds. The average fracture strength is 1.36 GPa with a standard deviation of 0.14 GPa, and the Weibull modulus is 10.4–11.7, respectively. Statistical analysis of the specimen size effect on the tensile strength predicated the size effect on the length, the surface area and the volume of the specimens due to microstructural and dimensional constraints. The fracture strength increases with the increase of the ratio of surface area to volume. In such cases the size effect can be traced back to the ratio of surface area to volume as the governing parameter. The test data account for the uncertainties in mechanical properties and may be used in the future reliability design of polysilicon MEMS. The testing of 40 specimens to failure results in a recommendation for design that the nominal strain be maintained below 0.0057.

Mechanical Properties of Mono-crystalline Silicon Thin Films Measured by Different Methods

Evaluation of Mechanical Properties and Strain Criterion for Realibility Design of Micromachined Polysilicon Thin Films

Characterization of the Young's Modulus and Residual Stresses for a Sputtered Silicon Oxynitride Film Using Micro-Structures

Young's Modulus Characterization of Nano-Level Silicon Nanomembrane

Measurement and Analysis on the Mechanical Properties of Silicon Carbide Film

Tensile mechanical behaviors of cubic silicon carbide thin films

Thermal and Mechanical Properties of Amorphous Silicon Carbide Thin Films Using the Femtosecond Pump-Probe Technique

Surface Roughness Effect on the Tensile Strength of Micromachined Polysilicon Films

Reduction in Modulus of Suspended Sub-2 nm Single Crystalline Silicon Nanomembranes

Size Effect on the Mechanical Properties of Microfabricated Polysilicon Thin Films

Mechanical Properties of Silicon Carbonitride Thin Films

Measurement of Young's modulus and residual stress of silicon microstructures

Nano-indentation Experiments on Anisotropic Mechanical Properties of Single Crystal Silicon

Method for measuring mechanical properties of MEMS thin film materials

Mechanical Properties of Directionally Solidified Polycrystalline Silicon at the Micro-/Nano-scale

A New Method for the Micro-Tensile Testing of Thin Film

Mechanical Characterization of Thermal SiO2micro-beams Through Tensile Testing

Mechanical characterization of biocompatible thin film materials by scanning along micro-machined cantilevers for micro-/nano-system

Young's Modulus Measurement of Nickel Silicide Film on Crystal Silicon by a Surface Profiler

Measurement of Material Properties for Polysilicon Thin Films by an Electrostatic Force Method

Scale Dependence of Tensile Strength of Micromachined Polysilicon MEMS Structures Due to Microstructural and Dimensional Constraints