Recrystallization of 75as Implanted Silicon by a Free Running Ruby Laser

J. L. Regolini,T. W. Sigmon,J. F. Gibbons,T. J. Magee,J. Peng
DOI: https://doi.org/10.1063/1.31686
1979-01-01
AIP Conference Proceedings
Abstract:In this paper we show that a ruby laser working in the free running mode can be used to anneal amorphous layers in silicon produced by 75As ion implantation. Target energy levels of 40 J/cm2 for millisec pulse lengths are representative of laser conditions necessary to promote recrystallization of the amorphous Si layers. For complete recrystallization of these layers a series of laser pulses were used resulting in electrical activity identical to thermally annealed control samples (1000 °C, 30 min). Data are presented for silicon implanted with 1014 to 1015 75As+/cm2 at an energy of 100 eV. Transmission electron microscopy and MeV 4He ion channeling show that the annealing process occurs by melting followed by liquid phase epitaxy. Localized melting of the amorphous layer in hot spots caused by laser beam inhomogeneity results in the formation of single crystal islands oriented on the substrate, distributed throughout the irradiated area. Further pulsing of the layers produces a random distribution of annealed islands, finally converging to 100% coverage. For substrates held at room temperatures, full annealing is reached after 64 pulses, while only 8 pulses are sufficient for 200 °C substrate temperatures. Spreading resistance measurements show the layer sheet resistance to be a function of the number of laser pulses and substrate temperature.
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