Recrystallization and activation of ultra-high-dose phosphorus-implanted silicon using multi-pulse nanosecond laser annealing

Hyunsu Shin,Juhee Lee,Minhyung Lee,Hwa-Yeon Ryu,Seran Park,Heungsoo Park,Dae-Hong Ko
DOI: https://doi.org/10.35848/1347-4065/ab69dd
IF: 1.5
2020-02-20
Japanese Journal of Applied Physics
Abstract:Highly phosphorus-doped silicon source/drains are investigated to improve the performance of N-typemetal-oxide-semiconductor field-effect transistors by decreasing their resistance and impartingstrain to their channels. To find effective high temperature annealing for the activation ofphosphorus in the source/drains, we apply single- and multi-pulse nanosecond laser annealing onhighly phosphorus-doped silicon. The microstructure, strain, and electrical properties of highlyphosphorus-doped silicon before and after laser annealing are analyzed. Our results demonstrate thatthe defects in both the recrystallized silicon and the end of range are decreased with 600 mJ cm −210-pulse annealing while considerable increase in phosphorus activation is achieved.
physics, applied
What problem does this paper attempt to address?