The Vibration Pickup of Micro-Pump Diaphragm Based on MEMS Technology Design

gang li,lei li,xiao feng zhao,dian zhong wen,yang yu
DOI: https://doi.org/10.4028/www.scientific.net/KEM.609-610.837
2014-01-01
Key Engineering Materials
Abstract:This paper designs a micro-pump silicon diaphragm vibration pickup sensor. In this new sensor which is based on piezoresistive effect, four MOSFETs with nc-Si/c-Si heterojunction drain and source are manufactured on the surface of silicon wafer by using the technique of CMOS and PECVD, at edge of <100> orientation of the N-type silicon diaphragm rectangle, and using MEMS technology, the back of the four MOSFETs device silicon substrate processed into silicon cup, which constitutes the vibration pickup sensor. The micro-pump silicon diaphragm vibration pickup sensor not only has all the advantages of conventional force sensitive resistance vibration pickup sensor, but also has the advantages of small temperature drift, high detection precision, and it can satisfy the micro-pump silicon diaphragm vibration requirements.
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