Study of Micro Vibration Pickup Sensor Fabricated by MEMS Technique

FANG Hua-Bin,LIU Jing-Quan,DONG Lu,CHEN Di,CAI Bing-Chu
DOI: https://doi.org/10.3969/j.issn.1001-2028.2006.07.023
2006-01-01
Abstract:Piezoelectric-cantilever micro vibration pickup sensor was realized using micro-electronic-mechanical systems (MEMS) technique such as sol-gel, RIE dry etching, wet chemical etching, UV-LIGA. The dimension of the vibration pickup is of cantilever length×width: 2 000 μm×600 μm, with silicon layer thickness 12 μm, PZT layer thickness 1.5 μm and the added Ni metal mass is of length×height: 600 μm×500 μm. The testing results show that the natural frequency of the structure is 610 Hz, which meet the low frequency application condition well, and the voltage output is about 562 mV under 1 gn resonant vibration drive.
What problem does this paper attempt to address?