Micro-patterning of PZT Thick Film by Lift-off Using ZnO As a Sacrificial Layer

Junhong Li,Wei Ren,Chenghao Wang,Mengwei Liu,Guoxiang Fan
DOI: https://doi.org/10.1016/j.ceramint.2015.02.028
IF: 5.532
2015-01-01
Ceramics International
Abstract:Micro-pattern of 8.2-μm-thick PZT films was prepared on Pt/Ti/SiO2/Si (100) substrate wafer by combining composite sol–gel and a novel lift-off using ZnO as a sacrificial layer. The processes include ZnO sacrificial layer deposition and patterning, PZT film preparation, and final lift-off. The results reveal the micro-pattern was better than that formed by wet etching, the PZT thick films patterned by lift-off possessed similar dielectric characters, better ferroelectric properties, and higher breakdown voltage than those of films patterned by wet etching. The lift-off is suitable for micro-patterning of PZT thick films.
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