Interfacial Microstructure and Mechanical Characterization of Silicon Nitride/nickel-Base Superalloy Joints by Partial Transient Liquid Phase Bonding

Liang Lan,Jianbo Yu,Zhigang Yang,Chuanjun Li,Zhongming Ren,Qiuliang Wang
DOI: https://doi.org/10.1016/j.ceramint.2015.09.115
IF: 5.532
2016-01-01
Ceramics International
Abstract:Si3N4 ceramic has been joined successfully to nickel-based superalloy by partial transient liquid phase (PTLP) bonding using Ni/Cu/Ti multi-interlayers. The interfacial microstructure and strength of the joints were investigated by scanning electron microscopy (SEM), transmission electron microscopy (TEM) and a three-point bending test. According to the TEM analysis, it was found that a TiN reaction layer was formed at the Si3N4/filler alloy interface. The TiN reaction layer was composed of two zones: one next to the Si3N4 ceramic with a thickness of about 0.4μm and the other zone with grains of about 0.8μm. The microstructure of the joint between the Si3N4 and the Cu interlayer can be described as: TiN layer with fine grains/TiN layer with coarse grains/Ti2Ni layer. Ni3Ti and CuTi2 phases were produced at the interface between the Cu interlayer and the DZ483 superalloy. The room-temperature average strength of the joint was 147MPa, and 96MPa was achieved when the joints were tested at 1073K.
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