Strength of ceramic joints bonded with reinforcements of intermetallic compounds

Zhang,De-Ku,Wu,Ai-Ping,Zou,Gui-Sheng,Liu,Gen-Mao
DOI: https://doi.org/10.3969/j.issn.1005-5053.2005.05.005
2005-01-01
Abstract:The microstructures and properties of Si_3N_4 joints bonded with Ag-Cu-Ti foils and Ti/Ni/Ti multi-interlayer were investigated.The results showed that intermetallic compounds formed as high melting point phase in Ag-Cu matrix.The observation of interfacial reaction layer showed that it is a two-layer structure.The microstructures and joint strengths can be affected by the parameters such as holding time,bonding temperature,thickness of Ti,Ni,and Ag-Cu-Ti.In these experiments,when other parameters were constant,the maximal joint strengths obtained at 30min.970℃,in 30μm of Ti,60μm of Ni and 150μm of Ag-Cu-Ti respectively.
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