Microstructure Evolution and Bonding Mechanism of Ti2SnC-Ti6Al4V Joint by Using Cu Pure Foil Interlayer

W. Yu,H. Zhao,Z. Huang,X. Chen,Y. Aman,S. Li,H. Zhai,Z. Guo,S. Xiong
DOI: https://doi.org/10.1016/j.matchar.2017.01.035
IF: 4.537
2017-01-01
Materials Characterization
Abstract:Ti2SnC, as one of functional ceramics with self-healing ability, was studied in welding with Ti6Al4V (TC4) through Cu interlayer under an applied mechanical pressure 10MPa in Ar atmosphere. Electron probe microanalyses indicated that the outward diffusion of Sn from Ti2SnC played a critical role in the chemical composition of the joining interface. After 60min, the reaction layers consisted of five zones: an interleaved zone (V) of β-Cu(Sn) and α-Cu(Sn), an enriched zone (IV) of Sn and intermetallic CuTi0.5Sn0.5 phase, the intermetallic zones (III) and (II) composed of TiCu4 and Ti3Cu4, a zone (I) consisting of β-Ti (Cu) phase. After shear tests, the corresponding fractographs indicated that the cracks mainly propagated in the Ti2SnC matrix with an intergranular fracture mode.
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