Abstract:The Ni‐PTFE mold is a nanocomposite mold fabricated by one‐pot electroforming using anodic aluminum oxide (AAO) foil as a template. It has low surface energy and low surface wettability, enabling precise, defect‐free nanopatterns down to 100 nm over 20 cycles of thermal nanoimprinting (T‐NIL). UV‐NIL also succeeded, with the nanocomposite mold exhibiting superior demolding compared to a silane‐coated Ni mold. Nanoimprinting large‐area structures, especially high‐density features like meta lenses, poses challenges in achieving defect‐free nanopatterns. Conventional high‐resolution molds for nanoimprinting are often expensive, typically constructed from inorganic materials such as silicon, nickel (Ni), or quartz. Unfortunately, replicated nanostructures frequently suffer from breakage or a lack of definition during demolding due to the high adhesion and friction at the polymer‐mold interface. Moreover, mold degradation after a limited number of imprinting cycles, attributed to contamination and damaged features, is a common issue. In this study, a disruptive approach is presented to address these challenges by successfully developing an anti‐sticking nanocomposite mold. This nanocomposite mold is created through the co‐deposition of nickel atoms and low surface tension polytetrafluoroethylene (PTFE) nanoparticles via electroforming. The incorporation of PTFE enhances the ease of polymer release from the mold. The resulting Ni‐PTFE nanocomposite mold exhibits exceptional lubrication properties and a significantly reduced surface energy. This robust nanocomposite mold proves effective in imprinting fine, densely packed nanostructures down to 100 nm using thermal nanoimprinting for at least 20 cycles. Additionally, UV nanoimprint lithography (UV‐NIL) is successfully performed with this nanocomposite mold. This work introduces a novel and cost‐effective approach to reusable high‐resolution molds, ensuring defect‐reduction production in nanoimprinting.

Study of Direct Nanoimprinting Processes by Molecular Dynamics Simulations

0701 Molecular Dynamics Simulation of Nano-Contact Between a Diamond Cutting Tool and a Copper Surface

Molecular dynamics simulation on nanoindentation response of a copper workpiece

Molecular Dynamics Simulation of Form Measurement Process of Soft Materials Using Atomic Force Microscope

Grain Size and Temperature Effects on the Indentation Induced Plastic Deformations of Nano Polycrystalline Diamond

Molecular Dynamics Investigation of the Deformation Mechanism of Gold with Variations in Mold Profiles during Nanoimprinting

Deformation Mechanism of Aluminum, Copper, and Gold in Nanoimprint Lithography Using Molecular Dynamics Simulation

Computer experiments on nano-indentation: A molecular dynamics approach to the elasto-plastic contact of metal copper

Molecular dynamics simulation study of the degradation of polymer nanopatterns created by nanoimprint

Coarse-Grain Simulations of the Polymer Filling Process in Nanolithography

Roll-to-plate micro-imprinting of large-area surface micro features: Experiments and a local simulation method

Study of deformation behavior of plastic metal materials during laser-assisted micro-imprinting formings

Nanoindentation in alumina coated Al: Molecular dynamics simulations and experiments

A Molecular Dynamics Simulations Study of the Influence of Prestrain on the Pop-In Behavior and Indentation Size Effect in Cu Single Crystals

Direct Metal Nano-Patterning on Irregular Substrate Surfaces by Reversal Imprint Lithography

Scanning probe lithography for nanoimprinting mould fabrication

Three Dimensional Molecular Dynamics Simulation of Nano-Lithography Process for Fabrication of Nanocomponents in Micro Electro Mechanical Systems (MEMS) Applications

Toward Defect‐Free Nanoimprinting

An experimental study on a rapid micro imprinting process

Towards understanding the influence of structured indenters geometry on material deformation behavior of indentation process

Nanoindentation-induced interface behavior between DLC film and monocrystalline silicon substrate at high temperature: A molecular dynamics simulation study