Fabrication of a Three-Layer SU-8 Mould with Inverted T-shaped Cavities Based on a Sacrificial Photoresist Layer Technique

Junshan Liu,Dong Zhang,Baoyong Sha,Penghe Yin,Zheng Xu,Chong Liu,Liding Wang,Feng Xu,Lin Wang

DOI: https://doi.org/10.1007/s10544-014-9868-y

2014-01-01

Biomedical Microdevices

Abstract:A novel method for fabricating a three-layer SU-8 mould with inverted T-shaped cavities is presented. The first two SU-8 layers were spin coated and exposed separately, and simultaneously developed to fabricate the bottom and the horizontal part of the inverted T-shaped cavity. Then, a positive photoresist was filled into the cavity, and a wet lapping process was performed to remove the excess photoresist and make a temporary substrate. The third SU-8 layer was spin coated on the temporary substrate to make the vertical part of the inverted T-shaped cavity. The sacrificial photoresist layer can prevent the first two SU-8 layers from being secondly exposed, and make a temporary substrate for the third SU-8 layer at the same time. Moreover, the photoresist can be easily removed with the development of the third SU-8 layer. A polydimethylsiloxane (PDMS) microchip with arrays of T-shaped cantilevers for studying the mechanics of cells was fabricated by using the SU-8 mould.