Characterization of the Interface Between the Hf-based High-K Thin Film and the Si Using Spatially Resolved Electron Energy-Loss Spectroscopy.

X. F. Wang,Quan Li,P. F. Lee,J. Y. Dai,X. G. Gong
DOI: https://doi.org/10.1016/j.micron.2009.07.009
IF: 2.381
2009-01-01
Micron
Abstract:The interfacial structures of HfO(2) and HfAlO thin films on Si have been investigated using spatially resolved electron energy-loss spectroscopy. We have found that interfaces are not atomically sharp, and variation in the symmetry of the local atomic coordination lasts for a couple of monolayers for both the as-deposited HfO(2) and the HfAlO samples. Annealing of the HfO(2) film in the oxygen environment leads to the formation of a thick SiO(2)/SiO(x) stack layer in-between the original HfO(2) and the Si substrate. As a comparison, the interfacial stability is significantly improved by Al incorporation into the HfO(2) film (forming HfAlO), which effectively reduced/eliminated the interfacial silicon oxide formation during the oxygen annealing process. The mechanism of the high-k film/substrate stabilization by Al incorporation is discussed based on the experimental results.
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