Electrical Transport of Bottom-Up Grown Single-Crystal Si1−xGexnanowire

W. F. Yang,S. J. Lee,G. C. Liang,S. J. Whang,D. L. Kwong
DOI: https://doi.org/10.1088/0957-4484/19/22/225203
IF: 3.5
2008-01-01
Nanotechnology
Abstract:In this work, we fabricated an Si1-xGex nanowire (NW) metal-oxide-semiconductor field-effect transistor (MOSFET) by using bottom-up grown single-crystal Si1-xGex NWs integrated with HfO2 gate dielectric, TaN/Ta gate electrode and Pd Schottky source/drain electrodes, and investigated the electrical transport properties of Si1-xGex NWs. It is found that both undoped and phosphorus-doped Si1-xGex NW MOSFETs exhibit p-MOS operation while enhanced performance of higher I-on similar to 100 nA and I-on/I-off similar to 10(5) are achieved from phosphorus-doped Si1-xGex NWs, which can be attributed to the reduction of the effective Schottky barrier height (SBH). Further improvement in gate control with a subthreshold slope of 142 mV dec(-1) was obtained by reducing HfO2 gate dielectric thickness. A comprehensive study on SBH between the Si1-xGex NW channel and Pd source/drain shows that a doped Si1-xGex NW has a lower effective SBH due to a thinner depletion width at the junction and the gate oxide thickness has negligible effect on effective SBH.
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