Abstract:Field programmable gate arrays (FPGAs) based time-to-digital converters (TDCs) have been broadly investigated and widely used in recent years. However, voltage variations on the power distribution network (PDN) of FPGA are significantly affecting and sometimes devastating to the TDC performance. In this paper, we experimentally measure the performance changes of the tapped delay line (TDL) based TDC under conditions that the PDN has static and transient voltage variations and analyze the voltage influences theoretically. The test results show 0.2%/mV degradation of the TDC resolution with voltage drop and 12%1mV deterioration of the average RMS precision with voltage deviation from typical. Besides, performance degradation due to transient voltage fluctuations caused by switching activities of adjacent digital circuits is also experimentally demonstrated. In particular, the RMS precision exhibits periodic deterioration with the measured time interval, which can be reasonably explained in theory. For the influence coming from static voltage variations, we find the performance change can be greatly suppressed by the dynamic calibration method. However, for the influence coming from voltage transients, the performance degradation is inevitable, which raises a warning for FPGA management, especially for multi-tenant FPGAs where multiple untrusting cloud users simultaneously reside in a single FPGA. The test results and theoretical analysis in this paper can guide system optimization and real-time correction to reduce the impact of voltage transients.

Impacts of Transient Voltage Clamp on CPU Power Delivery

Transient-Voltage-Clamp Circuit Design Based on Constant Load Line Impedance for Voltage Regulator Module

Design of a Transient Voltage Clamp (TVC) Based on Output Impedance Analysis

Power Reduction Through Measurement and Modeling of Users and CPUs: Summary

User- and Process-Driven Dynamic Voltage and Frequency Scaling.

Design of a Transient Voltage Clamp (TVC) for 4 Switch Buck Boost (4SBB) Converter

Power Integrity Analysis of TSV Based 3-D Integrated Circuits

Microprocessor Power Management Integration by Vrb-Cpu Approach

Comprehensive study of the impact of TSV induced thermo-mechanical stress on 3D IC device performance

Performance-Aware Power Management in Embedded Controllers with Multiple-Voltage Processors

A Current Controllable Active Transient-Voltage Compensation Circuit for Voltage Regulator Module

Investigation of Candidate VRM Topologies for Future Microprocessors

Area-efficient Transient Power-Rail Electrostatic Discharge Clamp Circuit with Mis-Triggering Immunity in a 65-Nm CMOS Process

Impact of TSV Induced Thermo-Mechanical Stress on Semiconductor Device Performance

Systematic Analysis for Static and Dynamic Drops in Power Supply Grids of 3-D Integrated Circuits

A Junction Temperature Monitoring Method for IGBT Modules Based on Turn-Off Voltage with Convolutional Neural Networks

MVRC and Its Tolerance Analysis For Microprocessor Power Management

Impacts of the MTCMOS technology on power supply network: a full-chip perspective

Study on Voltage Influence on FPGA-Based Time-to-Digital Converters.

Monolithic/Modularized Voltage Regulator Channel

Novel Multifunctional Transient Voltage Suppressor Technology for Modular EOS/ESD Protection Circuit Designs