Investigation of the Adhesion Properties Between COxMOy Alloys and Porous Low-K

Li-Ao Cao,Hui Feng,Xu Wang,Xin-Ping Qu
DOI: https://doi.org/10.1109/icsict.2014.7021186
2014-01-01
Abstract:In this work, the adhesion properties between different metal films, including Co, Mo, and novel single layer barrier - CoMo alloys with porous low-k dielectrics (k=2.3) have been investigated by using Four-point bending (FPB) tests for the first time. The results show that, Mo has the highest adhesion energy with porous low-k, while Co has the lowest among the test material including reference Ta/TaN. The adhesion ability between CoxMoy films and low-k dielectrics is increased as the Mo concentration increases.
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