Abstract:Printing of electrical circuits and interconnects using isotropic conductive adhesives (ICAs) is of great interest due to their low-temperature processing and compatibility with substrates for applications in sensors, healthcare, and flexible devices. As a lower cost alternative to silver (Ag), copper (Cu)-filled ICAs are desirable but limited by the formation of high-resistivity Cu surface oxides. To overcome this limitation, self-assembled monolayers (SAMs) of octadecanethiol (ODT) have been demonstrated to reduce the oxidation of micrometer-scale Cu powder particles for use in ICAs. However, the deposition and function of the SAM require further investigation, as described in this paper. As part of this work, the stages of the SAM deposition process, which included etching with hydrochloric acid to remove pre-existing oxides, were studied using X-ray photoelectron spectroscopy (XPS), which showed low levels of subsequent Cu oxidation when ODT coated. The treated Cu powders were combined with one- or two-part epoxy resins to make Cu-ICAs, and the effect of the Cu surface condition and weight loading on electrical conductivity was examined. When thermally cured in an inert argon atmosphere, ICAs filled with Cu protected by ODT achieved electrical conductivity up to 20 × 105 S·m-1, comparable to Ag-ICAs, and were used to make a functional circuit. To understand the function of the SAM in these Cu-ICAs, scanning and transmission electron microscopy were used to examine the internal micro- and nano-structures along with the elemental distribution at the interfaces within sections taken from cured samples. Sulfur (S), indicative of the ODT, was still detected at the internal polymer-metal interface after curing, and particle-to-particle contacts were also examined. XPS also identified S on the surface of cured Cu-ICAs even after thermal treatment. Based on the observations, electrical contact and conduction mechanisms for these Cu-filled ICAs are proposed and discussed.

Integration of Self-Assembled Monolayers for Cobalt/Porous Low-k Interconnects

Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation

Comparison of Cobalt Integration with Various Dielectric Materials under Thermal and Electrical Stress

A Comprehensive study of reliability improvement for 65nm Cu/Low-k process

Effect of in-line electron beam treatment on the electrical performance of Cu/organic low-k damascene interconnects

Study of A Single Layer Ultrathin Como Film As A Direct Plateable Adhesion/Barrier Layer for Next Generation Interconnect

The Role of Dipotassium Ethylenediaminetetraacetic Acid and Potassium Oleate on Chemical Mechanical Planarization Relevant to Heterogeneous Materials of Cobalt Interconnects

Reliability Studies of Barrier Layers for Cu/PAE Low-K Interconnects.

Synergistic enhancement of adhesion and electromigration reliability of cobalt via super-diluted (0.06 at.%) tungsten alloying as next-generation interconnect materials

Slurry System Establishment and Optimization for Advanced Cobalt Interconnect Metallization

Aminosilanization Nanoadhesive Layer for Nanoelectric Circuits with Porous Ultralow Dielectric Film

Interfacial Design and Functionization on Metal Electrodes Through Self-Assembled Monolayers

Plasma Combined Self-Assembled Monolayer Pretreatment on Electroplated-Cu Surface for Low Temperature Cu–Sn Bonding in 3D Integration

A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections

Study of CoTa Alloy As Barrier Layer for Cu/low-k Interconnects

Understanding electromigration failure behaviors of narrow cobalt lines and the mechanism of reliability enhancement for extremely dilute alloying of manganese oxide

Weak interaction engineering on thermal transport in metal-organic semiconductor nanocomposites with self-assembled monolayers

Functionalizing Self-Assembled Monolayers to Reduce Interface Scattering in Ruthenium/dielectric for Next-Generation Microelectronic Interconnects

Metal–Molecule–Metal Junctions on Self-Assembled Monolayers Made with Selective Electroless Deposition

The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives

A Novel Low-temperature Co-Co Direct Bonding for Future 3D Interconnection