Abstract:An layer of Cu 6 Sn 5 intermetallic compound (IMC) is formed during the interfacial reactions between lead-free solder and Cu substrate, and it plays a pivotal role in the reliability of solder joint. There are two different growth morphologies of Cu 6 Sn 5 grains-scalloped grain and prism grain. Scallop grains are commonly formed at the interface during the heating up and isothermal heating. Its growth behavior can be explained by interfacial reaction and ripening mechanism. Meanwhile, during cooling, prism grains are often formed, and its growth is driven by the flux of the interfacial reaction. Moreover, in device manufacturing procedure, several reflows are required; the solder joints have to be remelted many times and this introduces new problems related to altered morphology of Cu 6 Sn 5 grains. Several researchers have found that the two morphologies of Cu 6 Sn 5 grains would interconvert in different ways. Nevertheless, it is still hard to give a full and detail description of the evolution behavior of Cu 6 Sn 5 morphology during multiple reflows due to the lack of direct observation on interfacial reaction. In situ study on the growth behavior of Cu 6 Sn 5 during a single reflow has been reported. But for multiple reflows, the change in solubility of Cu in Sn during every heating and cooling stage could have great influence in the formation of two differing morphologies. On the other hand, due to the high content of reactive species of Sn and the increasing content of Cu element with reflow cycles, the growth kinetics of interfacial compounds on solder/substrate become more complicated. In this work, growth behavior of interfacial intermetallic compound in multiple reflow process for air cooling (AC), half cooling (HC, cooling in furnace without window) and furnace cooling (FC) was investigated by Shanghai Synchrotron Radiation Facility (SSRF) and scanning electron microscope (SEM). Pure Sn (99.95%) foils were used as solder and pure Cu (99.99%) sheets were employed as substrates. It was found that scallop Cu 6 Sn 5 formed at the interface during the heating stage of a reflow and converted to prism type during subsequent cooling, then transformed back to the scalloped grains of larger size during heating stage of the next reflow and so on. Furthermore, SSRF images illustrated that IMC dissolution phenomenon appeared and prism-type grains gradually sharpened into scallops during the heating stage. In addition, time exponent value obtained from the slop of ln(Δy) versus lnt increased with cooling rate slower.

The Growth Behavior of Imc on the Sn/Cu Interface During Solidification of Multiple Reflows

The Effect of Cooling Rate on Growth Kinetics of Interfacial IMCs During Multiple Reflows

Evolution Behavior and Growth Kinetics of Intermetallic Compounds at Sn/Cu Interface During Multiple Reflows

Growth Behavior of Cu6Sn5 Grains at Sn3.0Ag/(001)Cu Soldering Interface

Growth Behavior of Preferentially Scalloped Intermetallic Compounds at Extremely Thin Peripheral Sn/Cu Interface

Quasi In-Situ Study Of Morphological Evolution Of The Interfacial Imc In Single-Sided Interface Sn-0.3ag-0.7cu/Cu Joints During Multiple Reflow Process

Growth behavior and morphology evolution of interfacial (Cu,Ni)6Sn5 in (001)Cu/Sn/Ni micro solder joints

In Situ Study of Real-Time Growth Behavior of IMC Morphology Evolution During the Sn/Cu Soldering Cooling Stage

Roles of Interfacial Heat Transfer and Relative Solder Height on Segregated Growth Behavior of Intermetallic Compounds in Sn/Cu Joints During Furnace Cooling

The Effect of Reflow Temperature on IMC Growth in Sn/Cu and Sn0.7Cu/Cu Solder Bumps During Multiple Reflows

Growth Behavior and Orientation Evolution of Cu6Sn5 Grains in Micro Interconnect During Isothermal Reflow

In Situ Study The Effects Of Cu Addition On The Rapidly Growth Of Cu6sn5 At The Sn-Base Solder/Cu L-S Interface During Soldering Heat Preservation Stage

Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface

Growth Behavior of IMCs on <001>-Oriented and Large-grain Electroplated Cu Substrate

Competitive growth of Cu 3 Sn and Cu 6 Sn 5 at Sn/Cu interface during various multi-reflow processes

Size Effect of IMC Growth in Liquid-Solid Reflow Reaction at SAC305/Cu Interface

Effect of Initial Cu Concentration on the IMC Size and Grain Aspect Ratio in Sn–xCu Solders During Multiple Reflows

Influence Of Soldering Temperature And Dwelling Time On Morphological Evolution Of Cu6sn5 Intermetallic Compound At The Sn-3.0ag-0.5cu/Cu Interface

A Study on the Interfacial Reaction of Sn58Bi/Cu Soldered Joints under Various Cooling and Aging Conditions

In situ study on dissolution and growth mechanism of interfacial Cu 6 Sn 5 in wetting reaction

In Situ Study of the Real-Time Growth Behavior of Cu6Sn5 at the Sn/Cu Interface During the Soldering Reaction