Abstract:With the development of three-dimensional (3D) packaging technology, the dimension of solder joints is continuously shrinking. How to ensure the service performance of solder joints has become an important issue. As the solder joint height reduces to several microns, the total growth rate of Cu-Sn intermetallic compounds (IMCs) increases accordingly, meanwhile, whose proportion in solder joints will increase rapidly. At this point, the physics and mechanical characters of the solder joints won't depend primarily on the solder alloy, but on the IMCs. However, since the IMCs formed in solder joints have a non-cubic crystal structure, the IMC grains have a strong anisotropy along different crystal directions. Therefore, effective control of the orientation and growth behavior of IMC grains becomes a key issue in the 3D packaging fabricating. In the current study, the (001)Cu/Sn/Cu joints are fabricated by soldering under isothermy and temperature gradient (TG), respectively. Initially, the resultant η-Cu 6 Sn 5 grains show faceted prism textures with an intersecting angle of 90° on the (001)Cu end. However, in the isothermal soldering process, the initial faceted prism textures gradually disappear. By applying a TG, the IMCs on cold end, i.e. (001)Cu end, continue to grow rapidly and maintain the regular grain morphology. Moreover, the epitaxial growth direction of the IMCs is about parallel to the TG direction. These results provide a potential way to control the morphology and growth of Cu 6 Sn 5 grains in 3D packaging technology.

Growth Behavior of IMCs on <001>-Oriented and Large-grain Electroplated Cu Substrate

Growth Behavior of Cu6Sn5 Grains at Sn3.0Ag/(001)Cu Soldering Interface

Growth Behavior of Preferentially Scalloped Intermetallic Compounds at Extremely Thin Peripheral Sn/Cu Interface

Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

Growth Behavior of Intermetallic Compounds at SnAgCu/Ni and Cu Interfaces

Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient

The Growth Behavior of Imc on the Sn/Cu Interface During Solidification of Multiple Reflows

Growth behavior and morphology evolution of interfacial (Cu,Ni)6Sn5 in (001)Cu/Sn/Ni micro solder joints

Growth Behavior of Cu<inf>6</inf>Sn<inf>5</inf> Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient

Morphology and Growth of Intermetallics at the Interface of Sn-based Solders and Cu with Different Surface Finishes

Effects of Cu Orientation and Stand-Off-Height on the Microstructure of Cu/Snagcu Interface

Quasi In-Situ Study Of Morphological Evolution Of The Interfacial Imc In Single-Sided Interface Sn-0.3ag-0.7cu/Cu Joints During Multiple Reflow Process

Progress of Study on Formation Mechanism of IMC at the Interface Between the Sn-based Solder and Cu Substrate

Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interface

Growth kinetics of IMCs in Cu-Sn intermetallic joints during isothermal soldering process

Effect of Sn Surface Diffusion on Growth Behaviors of Intermetallic Compounds in Cu/ni/snag Microbumps

Investigation on Cu–Sn Intermetallic Compounds Growth and Signal Transmission Loss of the Diverse Copper Lines after Soldering in Printed Circuit Board

IMC Growth at the Interface of Sn–2.0Ag–2.5Zn Solder Joints with Cu, Ni, and Ni–W Substrates

Size Effect of IMC Growth in Liquid-Solid Reflow Reaction at SAC305/Cu Interface

Insight into the influence of Cu6Sn5/Cu micro-interface configuration on growth behavior of Cu-Sn interfacial intermetallic compounds in Sn/Cu solder joint

Growth and evolution kinetics of intermetallic compounds in Sn-0.7Cu-10Bi-0.15Co/Cu interface