Abstract:An layer of Cu 6 Sn 5 intermetallic compound (IMC) is formed during the interfacial reactions between lead-free solder and Cu substrate, and it plays a pivotal role in the reliability of solder joint. There are two different growth morphologies of Cu 6 Sn 5 grains-scalloped grain and prism grain. Scallop grains are commonly formed at the interface during the heating up and isothermal heating. Its growth behavior can be explained by interfacial reaction and ripening mechanism. Meanwhile, during cooling, prism grains are often formed, and its growth is driven by the flux of the interfacial reaction. Moreover, in device manufacturing procedure, several reflows are required; the solder joints have to be remelted many times and this introduces new problems related to altered morphology of Cu 6 Sn 5 grains. Several researchers have found that the two morphologies of Cu 6 Sn 5 grains would interconvert in different ways. Nevertheless, it is still hard to give a full and detail description of the evolution behavior of Cu 6 Sn 5 morphology during multiple reflows due to the lack of direct observation on interfacial reaction. In situ study on the growth behavior of Cu 6 Sn 5 during a single reflow has been reported. But for multiple reflows, the change in solubility of Cu in Sn during every heating and cooling stage could have great influence in the formation of two differing morphologies. On the other hand, due to the high content of reactive species of Sn and the increasing content of Cu element with reflow cycles, the growth kinetics of interfacial compounds on solder/substrate become more complicated. In this work, growth behavior of interfacial intermetallic compound in multiple reflow process for air cooling (AC), half cooling (HC, cooling in furnace without window) and furnace cooling (FC) was investigated by Shanghai Synchrotron Radiation Facility (SSRF) and scanning electron microscope (SEM). Pure Sn (99.95%) foils were used as solder and pure Cu (99.99%) sheets were employed as substrates. It was found that scallop Cu 6 Sn 5 formed at the interface during the heating stage of a reflow and converted to prism type during subsequent cooling, then transformed back to the scalloped grains of larger size during heating stage of the next reflow and so on. Furthermore, SSRF images illustrated that IMC dissolution phenomenon appeared and prism-type grains gradually sharpened into scallops during the heating stage. In addition, time exponent value obtained from the slop of ln(Δy) versus lnt increased with cooling rate slower.

In Situ Study of Real-Time Growth Behavior of IMC Morphology Evolution During the Sn/Cu Soldering Cooling Stage

In Situ Study The Effects Of Cu Addition On The Rapidly Growth Of Cu6sn5 At The Sn-Base Solder/Cu L-S Interface During Soldering Heat Preservation Stage

Formation Mechanism and Kinetic Analysis of the Morphology of Cu 6 Sn 5 in the Spherical Solder Joints at the Sn/Cu Liquid–solid Interface During Soldering Cooling Stage

In Situ Study of the Real-Time Growth Behavior of Cu6Sn5 at the Sn/Cu Interface During the Soldering Reaction

The study of cooling process' effect on the growth of IMC at Sn-3.5Ag/Cu soldering interface

Quasi In-Situ Study Of Morphological Evolution Of The Interfacial Imc In Single-Sided Interface Sn-0.3ag-0.7cu/Cu Joints During Multiple Reflow Process

In situ study the effects of Cu addition on the rapidly growth of Cu<inf>6</inf>Sn<inf>5</inf> at the Sn-base solder/Cu L-S interface during soldering heat preservation stage

Synchrotron Radiation Imaging Study on the Rapid IMC Growth of Sn–xAg Solders with Cu and Ni Substrates During the Heat Preservation Stage

Growth Behavior of Preferentially Scalloped Intermetallic Compounds at Extremely Thin Peripheral Sn/Cu Interface

In Situ Study On The Effect Of Thermomigration On Intermetallic Compounds Growth In Liquid-Solid Interfacial Reaction

The Growth Behavior of Imc on the Sn/Cu Interface During Solidification of Multiple Reflows

The Morphology Variation of IMC on the Solder/bubble Interface under Different Cooling Rates and Temperatures

Synchrotron Radiation in Situ Study on Liquid-Solid Thermomigration in Cu/Sn/Ni Solder Joint

The Effect of Cooling Rate on Growth Kinetics of Interfacial IMCs During Multiple Reflows

Roles of Interfacial Heat Transfer and Relative Solder Height on Segregated Growth Behavior of Intermetallic Compounds in Sn/Cu Joints During Furnace Cooling

A Study on the Interfacial Reaction of Sn58Bi/Cu Soldered Joints under Various Cooling and Aging Conditions

Quasi-in-situ observation on diffusion anisotropy dominated asymmetrical growth of Cu-Sn IMCs under temperature gradient

Growth kinetics of IMCs in Cu-Sn intermetallic joints during isothermal soldering process

Thermoelectric Coupling Effect on the Interfacial IMC Growth in Lead-Free Solder Joint

Growth Behavior of Cu6Sn5 Grains at Sn3.0Ag/(001)Cu Soldering Interface

Study on precipitation and dissolution of interfacial Cu6Sn5 during thermomigration