Abstract:A continuous fabrication strategy for constructing permeable, patternable, and super‐stretchable electronic fiber using liquid metal and porous SBS fiber as building blocks are proposed. A multifunctional fiber with three individual layers for lighting, data transmission, and biochemical sensing functions, as well as an artificial neuron integrating multimodal sensing and electrical signal transmission capabilities are constructed based on the proposed strategy. Stretchable electronic fibers are essential for soft electronics because of their small footprint, light weight, high compliance, and ease of integration. To date, the majority of stretchable electronic fibers are fabricated with solidly filled fiber substrates where the exchange of gas or liquid between the outer environment and the inner part of the fiber is largely inhibited, if not impossible. The nonpermeability largely wastes the inner volume of the fiber, especially for those sensor fibers. Here, a continuous fabrication of permeable and super‐stretchable liquid metal fibers for constructing high‐integration‐density and multifunctional electronic fibers are reported. The electronic fiber is comprised of self‐assembled porous elastomer fibers and multilayers of coaxially arranged liquid metal circuits patterned in the three‐dimensional space of the fiber matrix. The micron‐scale porous structure of the fiber matrix enables high permeability for effective materials/energy exchange between the surrounding environment and the components in different layers of the fiber. As a proof of concept, a stretchable multifunctional electronic fiber incorporated with three individual layers responsible for lighting, data transmission, and biochemical sensing, as well as an artificial neuron integrating multi‐modal sensing and electrical signal transmission capabilities, illustrating the potential of the fiber fabrication strategy for stretchable electronics applications is demonstrated.

Micro devices integration with stretchable spring embedded in long PDMS-fiber for flexible electronics

Micro devices integration with large-area 2D chip-network using stretchable electroplating copper spring

Direct Fabrication of Stretchable Electronics on a Polymer Substrate with Process‐Integrated Programmable Rigidity

Development of a large-area chip network with multidevice integration using a stretchable electroplated copper spring

Stretchable Integrated Microphotonics

Recoverable/stretchable Polymer Spring with Embedded CNTs Electrical Routing for Large-Area Electronic Applications

Monolithically Integrated Stretchable Photonics

Integrated Photonics Put at Full Stretch: Flexible and Stretchable Photonic Devices Enabled by Optical and Mechanical Co-Design

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Designable Integration of Silicide Nanowire Springs as Ultra-Compact and Stretchable Electronic Interconnections

Soft Elastomers with Programmable Stiffness As Strain-Isolating Substrates for Stretchable Electronics.

Develop And Implement A Novel Tactile Sensor Array With Stretchable And Flexible Grid-Like Spring

Wafer-scale Integration of Stretchable Semiconducting Polymer Microstructures Via Capillary Gradient

Monolithic High-Index-Contrast Stretchable Photonics

Stretchable Electronics Based on PDMS Substrates

Localized modulus-controlled PDMS substrate for 2D and 3D stretchable electronics

In-situ Forming Ultra-Mechanically Sensitive Materials for High-Sensitivity Stretchable Fiber Strain Sensors.

Three-Dimensional Stretchable Microelectronics by Projection Microstereolithography (PμSL)

A Mechanically Interlocking Strategy Based on Conductive Microbridges for Stretchable Electronics

Continuous Melt‐Drawing of Highly Aligned Flexible and Stretchable Semiconducting Microfibers for Organic Electronics

Permeable and Patternable Super‐Stretchable Liquid Metal Fiber for Constructing High‐Integration‐Density Multifunctional Electronic Fibers