Abstract:Intrinsically stretchable electronics with skin-like mechanical properties have been identified as a promising platform for emerging applications ranging from continuous physiological monitoring to real-time analysis of health conditions, to closed-loop delivery of autonomous medical treatment 1 – 7 . However, current technologies could only reach electrical performance at amorphous-silicon level (that is, charge-carrier mobility of about 1 cm 2 V −1 s −1 ), low integration scale (for example, 54 transistors per circuit) and limited functionalities 8 – 11 . Here we report high-density, intrinsically stretchable transistors and integrated circuits with high driving ability, high operation speed and large-scale integration. They were enabled by a combination of innovations in materials, fabrication process design, device engineering and circuit design. Our intrinsically stretchable transistors exhibit an average field-effect mobility of more than 20 cm 2 V −1 s −1 under 100% strain, a device density of 100,000 transistors per cm 2 , including interconnects and a high drive current of around 2 μA μm −1 at a supply voltage of 5 V. Notably, these achieved parameters are on par with state-of-the-art flexible transistors based on metal-oxide, carbon nanotube and polycrystalline silicon materials on plastic substrates 12 – 14 . Furthermore, we realize a large-scale integrated circuit with more than 1,000 transistors and a stage-switching frequency greater than 1 MHz, for the first time, to our knowledge, in intrinsically stretchable electronics. Moreover, we demonstrate a high-throughput braille recognition system that surpasses human skin sensing ability, enabled by an active-matrix tactile sensor array with a record-high density of 2,500 units per cm 2 , and a light-emitting diode display with a high refreshing speed of 60 Hz and excellent mechanical robustness. The above advancements in device performance have substantially enhanced the abilities of skin-like electronics.

Development of a large-area chip network with multidevice integration using a stretchable electroplated copper spring

Micro devices integration with large-area 2D chip-network using stretchable electroplating copper spring

A hierarchical computational model for stretchable interconnects with fractal-inspired designs

Recoverable/stretchable Polymer Spring with Embedded CNTs Electrical Routing for Large-Area Electronic Applications

Micro devices integration with stretchable spring embedded in long PDMS-fiber for flexible electronics

Develop And Implement A Novel Tactile Sensor Array With Stretchable And Flexible Grid-Like Spring

Design and Fabrication of a Stretchable Circuit Board for Wireless Posture Measurement

Mechanics of Noncoplanar Mesh Design for Stretchable Electronic Circuits

Designable Integration of Silicide Nanowire Springs as Ultra-Compact and Stretchable Electronic Interconnections

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Stretchable and Foldable Silicon Integrated Circuits

Complementary Metal Oxide Silicon Integrated Circuits Incorporating Monolithically Integrated Stretchable Wavy Interconnects

A Mechanically Interlocking Strategy Based on Conductive Microbridges for Stretchable Electronics

Scalable Fabrication of Large-Scale, 3D, and Stretchable Circuits

Highly-integrated, miniaturized, stretchable electronic systems based on stacked multilayer network materials

BATCH TRANSFER APPARATUS FOR CHIPS RESULTING IN ENLARGED PITCH USING STRETCHABLE SILICON SPRING

Optimized Structural Designs for Stretchable Silicon Integrated Circuits

Monolithic Integration of Silicon Nanowire Networks As a Soft Wafer for Highly Stretchable and Transparent Electronics.

High-speed and Large-Scale Intrinsically Stretchable Integrated Circuits

Stretchable Interconnections for Flexible Electronic Systems

3D Stretchable Electronics with Stretchable Interlayer Connectors