Abstract:Intrinsically stretchable electronics with skin-like mechanical properties have been identified as a promising platform for emerging applications ranging from continuous physiological monitoring to real-time analysis of health conditions, to closed-loop delivery of autonomous medical treatment 1 – 7 . However, current technologies could only reach electrical performance at amorphous-silicon level (that is, charge-carrier mobility of about 1 cm 2 V −1 s −1 ), low integration scale (for example, 54 transistors per circuit) and limited functionalities 8 – 11 . Here we report high-density, intrinsically stretchable transistors and integrated circuits with high driving ability, high operation speed and large-scale integration. They were enabled by a combination of innovations in materials, fabrication process design, device engineering and circuit design. Our intrinsically stretchable transistors exhibit an average field-effect mobility of more than 20 cm 2 V −1 s −1 under 100% strain, a device density of 100,000 transistors per cm 2 , including interconnects and a high drive current of around 2 μA μm −1 at a supply voltage of 5 V. Notably, these achieved parameters are on par with state-of-the-art flexible transistors based on metal-oxide, carbon nanotube and polycrystalline silicon materials on plastic substrates 12 – 14 . Furthermore, we realize a large-scale integrated circuit with more than 1,000 transistors and a stage-switching frequency greater than 1 MHz, for the first time, to our knowledge, in intrinsically stretchable electronics. Moreover, we demonstrate a high-throughput braille recognition system that surpasses human skin sensing ability, enabled by an active-matrix tactile sensor array with a record-high density of 2,500 units per cm 2 , and a light-emitting diode display with a high refreshing speed of 60 Hz and excellent mechanical robustness. The above advancements in device performance have substantially enhanced the abilities of skin-like electronics.

Scalable Fabrication of Large-Scale, 3D, and Stretchable Circuits

High-Resolution Rapid Prototyping of Liquid Metal Electronics by Direct Writing on Highly Prestretched Substrates

Direct Fabrication of Stretchable Electronics on a Polymer Substrate with Process‐Integrated Programmable Rigidity

High Resolution Direct Writing Liquid Metal Patterns for Printed Stretchable Electronics

Three-dimensional Integrated Stretchable Electronics

Three-Dimensional Coprinting Of Liquid Metals For Directly Fabricating Stretchable Electronics

Three-Dimensional Stretchable Microelectronics by Projection Microstereolithography (PμSL)

A Cost-Effective and Solderability Stretchable Circuit Boards for Wearable Devices

Hybrid Printed Rigidity‐Programmable Substrate/Liquid Metal 3D Circuits Toward Stretchable Electronics

Stretchable and Foldable Silicon Integrated Circuits

A Mechanically Interlocking Strategy Based on Conductive Microbridges for Stretchable Electronics

Ultrathin Silicon Circuits with Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Directly Printed Interconnection Wires between Layers for 3D Integrated Stretchable Electronics

3D Stretchable Electronics with Stretchable Interlayer Connectors

High-speed and Large-Scale Intrinsically Stretchable Integrated Circuits

Facile Fabrication of Multilayer Stretchable Electronics Via a Two-mode Mechanical Cutting Process.

Preparation Technology of Stretchable Electrode Based on Laser Cutting

3D Printed Microstructures for Flexible Electronic Devices

Highly-integrated, miniaturized, stretchable electronic systems based on stacked multilayer network materials

Soft elastomeric composite materials with skin-inspired mechanical properties for stretchable electronic circuits.