Novel Copper Foam/Indium Composite Thermal Interface Materials for Advanced Flip Chip Ball Grid Array Packaging

Jing Wen,Jinyang Su,Canwen Wang,Wenhui Zhu,Liancheng Wang,Siyuan Lu

DOI: https://doi.org/10.1109/ICEPT63120.2024.10668639

2024-08-07

Abstract:The most common type of solder used as thermal interface material (TIM1) is indium (In) for LGA and PGA packaging. However, there is lack of applications of In TIM1 in FCBGA packaging due to the leakage or pump-out of liquid In TIM1 during the multiple reflow cycles of FCBGA packaging. Copper foam matrix embedded in In could prevent the leakage during the multiple reflow cycles for FCBGA packaging and improves the thermal conductivity of the In thermal interface materials. In this study, A novel copper foam/indium Composite TIM1 is prepared and a typical flip chip ball grid array (FCBGA) simulation model with a package size of $52.5\times 52.5$ mm was created. ANSYS ICEPAK was used for thermal analysis to discuss the effects of porosity of copper foam, bond line thickness (BLT), die area and other parameters of packaging on chip heat dissipation performance. It was revealed that increasing die area and TIM2 thermal conductivity can significantly decrease the maximum chip junction temperature of Die. Besides, decreasing the copper foam porosity from 95% to 60%, the Copper foam/In composite thermal interface material Young's modulus increased from 18.6GPa to 33.2GPa, thermal expansion coefficient increased from $27.5\times 10^{-6}/{}^{\circ}\mathrm{C}$ to $21.3\times 10^{-6}/{}^{\circ} \mathrm{C}$.

Materials Science,Engineering