An Analytical Model of Strain Isolation for Stretchable and Flexible Electronics

H. Cheng,J. Wu,M. Li,D. -H. Kim,Y. -S. Kim,Y. Huang,Z. Kang,K. C. Hwang,J. A. Rogers
DOI: https://doi.org/10.1063/1.3553020
IF: 4
2011-01-01
Applied Physics Letters
Abstract:One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length.
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