Investigation on Periodic Cracking of Elastic Film/substrate System by the Extended Finite Element Method

Xueling Fan,Weixu Zhang,Tiejun Wang,Guiwu Liu,Jinghua Zhang
DOI: https://doi.org/10.1016/j.apsusc.2011.02.111
IF: 6.7
2011-01-01
Applied Surface Science
Abstract:Multiple cracking behavior in a thin elastic film bonded to a thick elastic substrate is investigated by the extended finite element method. Stress and stress intensity factor are obtained using a periodic finite element model for the cracked film/substrate system. The influences of various parameters including crack length, film thickness, periodic crack spacing, and relative stiffness of the substrate on the stress and stress intensity factor are discussed in detail. It is demonstrated that the effects of geometric parameters are more sensitive than that of material property. In particular, the crack spacing has a saturation value due to interactions of neighboring cracks and relief of tensile stress in the film. The film/substrate couple with multiple periodic cracks can exhibit a positive potential in improving the durability of the film/substrate system. (C) 2011 Elsevier B. V. All rights reserved.
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