Elastoplastic Indentation Responses of Nanoporous Film/Substrate System

Fue Han,Changqing Chen,Yapeng Shen
DOI: https://doi.org/10.1080/10584587.2011.576915
2011-01-01
Integrated Ferroelectrics
Abstract:The elastoplastic indentation responses of a nanoporous film/substrate system to rigid sphere and circular cylindrical punch indenters are simulated by the finite element method. The porous film contains voids in the nanometer scale and arranged in the hexagonal manner. Determination of the macroscopic elastic-plastic properties of the film (i.e., the transverse isotropic indentation modulus, hardness, and yielding stress) using the indentation responses is explored. Obtained results show that the amethods.
What problem does this paper attempt to address?