Measurement of residual stresses by X-ray diffraction techniques in pyrite films prepared by magnetron sputtering

Zhaoju Luan,Yinlun Huang,DongWei Yao,Liang Meng

DOI: https://doi.org/10.1179/143307511X13109310554805

2013-01-01

Materials Research Innovations

Abstract:Pyrite films were prepared by magnetron sputtering and sulphuration treatment. The residual stresses in the pyrite films were studied as a function of sulphuration temperature. The microstructure was investigated by atomic force microscopy (AFM). The measurement was performed with a theta-2 theta mode glancing incidence X-ray diffraction (XRD) instrument. The residual stresses were calculated by using sin(2) psi method. The intrinsic stresses were estimated from the difference of the sulphurised pyrite films lattice constant and stress free pyrite films lattice constant. The thermal stresses were obtained from the empirical formula. The experimental results indicate that residual stresses stored in the pyrite films are compressive and the value of residual stresses decreases from 100 to 79 MPa with increasing sulphuration temperature from 623 to 873 K. The intrinsic stresses in the pyrite films are comprehensive and decrease with increasing sulphuration temperature. In contrast, the thermal stresses in pyrite films are tensile and tend to increase with sulphuration temperature.