Abstract:Recent progress in nanotechnology has enabled to design the advanced functional micro-/nanostructures utilizing the unique properties of ultrathin films. To ensure these structures can reach the expected functionality, it is necessary to know the density, generated internal stress and the material properties of prepared films. Since these films have thicknesses of several tens of nm, their material properties, including density, significantly deviate from the known bulk values. As such, determination of ultrathin film material properties requires usage of highly sophisticated devices that are often expensive, difficult to operate, and time consuming. Here, we demonstrate the extraordinary capability of a microcantilever commonly used in a conventional atomic force microscope to simultaneously measure multiple material properties and internal stress of ultrathin films. This procedure is based on detecting changes in the static deflection, flexural and torsional resonant frequencies, and the corresponding quality factors of the microcantilever vibrating in air before and after film deposition. In contrast to a microcantilever in vacuum, where the quality factor depends on the combination of multiple different mechanical energy losses, in air the quality factor is dominated just by known air damping, which can be precisely controlled by changing the air pressure. Easily accessible expressions required to calculate the ultrathin film density, the Poisson’s ratio, and the Young’s and shear moduli from measured changes in the microcantilever resonant frequencies, and quality factors are derived. We also show that the impact of uncertainties on determined material properties is only minor. The validity and potential of the present procedure in material testing is demonstrated by (i) extracting the Young’s modulus of atomic-layer-deposited TiO2 films coated on a SU-8 microcantilever from observed changes in frequency response and without requirement of knowing the film density, and (ii) comparing the shear modulus and density of Si3N4 films coated on the silicon microcantilever obtained numerically and by present method.

Calculation and simulation of the bending deformation of multilayer thin films microcantilever integrated with the microplasma reactor

Study of residual stress-induced deformation of multilayer cantilever for maskless microplasma etching

Simulation and experiments of intrinsic bending of multilayer microcantilever for maskless scanning plasma etching

Electromechanical Analysis and Simplified Modeling of Dielectric Elastomer Multilayer Bending Actuator

Calculation of Thermal Stress in Microstructure Fabricated by Multilayer Thin Films

Simulations of Interaction Between Flow and a Thin Elastic Beam Using Cip-Based Model with Adaptive Mesh

Numerical Simulation and Experimentation of Adjusting the Curvatures of Micro-Cantilevers Using the Water-Confined Laser-Generated Plasma

Control the shape and curvature of micromachined cantilever using multiple plasma chemistry bonding technology

Tuning the shape and curvature of micromachined cantilevers using multiple plasma treatments

Study of Local Stress Using Stress-Absorbing Si Diaphragm

Active Control of Surface Integrity in Thin Film Scratching and Finishing

A Novel Approach to Study Patterned Thin Film Local Stress for Microelectronics Application

Experiments on the Deformation of MEMS Mciro-Cantilever Using AFM

Thermal stress concentration points and stress mutations in nano-multilayer film structures

Design and fabrication of microcantilever probe integrated with microplasma reactor for maskless scanning plasma etching

Discharge properties and AFM imaging experiments of cantilever probe integrated with microplasma reactor

Elastic and elastic-plastic analysis of multilayer thin films filled with heterogeneous materials

Design and Fabrication of Microcantilever Probes Used for Microplasma Maskless Etching

Fabrication and Performance Optimization of the Microplasma Reactor with Composite Dielectrics

Simple Non-Destructive Method of Ultrathin Film Material Properties and Generated Internal Stress Determination Using Microcantilevers Immersed in Air

Fabrication of a novel microcantilever probe with inverted pyramidal microdischarge for maskless scanning plasma etching