Preparation of Si-based PZT pyroelectric thick film infrared detector

Jiaqiang Cao,Chuangui Wu,Qiangxiang Peng,Wenbo Luo,Wanli Zhang,Shu'an Wang
DOI: https://doi.org/10.3969/j.issn.1007-2276.2011.12.003
2011-01-01
Abstract:Lead zirconate titanate (PbZr 0.3Ti 0.7O 3) thick films and single element detectors for pyroelectric applications were fabricated on Si(100) substrates by MEMS and screen-printing technology. The preparation method and device processing technology were studied in detail. Firstly, the silicon-cup was etched by tetra-methyl ammonium hydroxide (TMAH) solution. Secondly, the Al 2O 3 barrier layer was prepared to prevent Si diffusion between PZT/Si through reactive radio frequency (RF) sputtering. Cool isostatic pressing experiments were conducted in order to increase the density of PZT thick films. Finally, the PZT ceramic thick films about 30 μm were achieved at a low sintering temperature about 850°C. The dielectric permittivity and loss angle tangent tested at 1 kHz under 25°C were 210 and 0.017 respectively. By using dynamic current method, pyroelectric coefficient of the PZT thick film was determined to be 1.5 × 10 -8 Ccm -2 K -1. The detectivity of detector with 3 mm × 3 mm area was measured by mechanically chopped blackbody radiation as the function of frequency. The results show that the single element detector obtains its maximum detectivity 7.4 × 10 7 cmHz 1/2W -1 at 112.9 Hz.
What problem does this paper attempt to address?