A Ferroelectric Semiconductor Field-Effect Transistor
Mengwei Si,Atanu K. Saha,Shengjie Gao,Gang Qiu,Jingkai Qin,Yuqin Duan,Jie Jian,Chang Niu,Haiyan Wang,Wenzhuo Wu,Sumeet K. Gupta,Peide D. Ye
DOI: https://doi.org/10.1038/s41928-019-0338-7
2020-01-10
Abstract:Ferroelectric field-effect transistors employ a ferroelectric material as a gate insulator, the polarization state of which can be detected using the channel conductance of the device. As a result, the devices are of potential to use in non-volatile memory technology, but suffer from short retention times, which limits their wider application. Here we report a ferroelectric semiconductor field-effect transistor in which a two-dimensional ferroelectric semiconductor, indium selenide ({\alpha}-In2Se3), is used as the channel material in the device. {\alpha}-In2Se3 was chosen due to its appropriate bandgap, room temperature ferroelectricity, ability to maintain ferroelectricity down to a few atomic layers, and potential for large-area growth. A passivation method based on the atomic-layer deposition of aluminum oxide (Al2O3) was developed to protect and enhance the performance of the transistors. With 15-nm-thick hafnium oxide (HfO2) as a scaled gate dielectric, the resulting devices offer high performance with a large memory window, a high on/off ratio of over 108, a maximum on-current of 862 {\mu}A {\mu}m-1, and a low supply voltage.
Applied Physics,Mesoscale and Nanoscale Physics,Materials Science