Abstract:An on-line thin film stress measuring system based on Hartmann-Shack sensor technique is introduced to measure the film stress of SiO_2, TiO_2, Ta_2O_5, Al_2O_3and ITO films at different thickness which are prepared by ion assisted deposition, and the effects of substrate materials and preparation parameters on the stresses of SiO_2 and TiO_2are investigated in details. The results show that the film stress as a function of the film thickness is linear in the initial stage of coating, and the film stress tends to be a stable value when the film thickness reaches a certain value. The thermal stress which resulted from the different coefficients of thermal between substrates and thin films can be diminished by choosing suitable substrates. In terms of TiO_2 films, the thermal stress plays a major role when the substrate temperature is below 150℃, but the compressive stress which resulted from the dense structure of films is dominant while the substrate temperature is above 150 ℃. However, the thermal stress in SiO_2 films is always dominant at different deposition temperatures. The tensile stress in SiO_2 films is mainly caused by the effects of ion assisted sputtering when the chamber pressure is below 1.7×10~(-2) Pa, and the tensile stress in SiO_2 films increases with the vacuum chamber's pressure increasing when it is above 1.7×10~(-2)Pa, but the refractive index decreases.

Effects of Substrate Materials and Deposition Parameters on Film Stress

Study on the Mechanism and Measurement of Stress of Tio2 and Sio2 Thin-Films

Analysis of stress in TiO2 thin film prepared with ion assisted deposition

Stress in Amorphous Siox:H Films Prepared by Plasma-Enhanced Chemical Vapor Deposition

Effect of Ion-Beam Assisted Deposition on the Film Stresses of TiO2 and SiO2 and Stress Control

Effects of Stress on the Adhesive Behavior of Photoresist

Growth and On-Line Stress Evaluation of TiO2 and SiO2 Films

Study on the Measurement and Mechanism of Stress in SiO2 Thin Films

RESIDUAL STRESSES IN OBLIQUE INCIDENCE DEPOSITED ALUMINA THIN FILM

The Effect Of Stress On The Dielectric And Tunable Properties Of Barium Stannate Titanate Thin Films

The Effects of Substrate on the Properties of Sol-Gel Derived TiO2 Films

Film thickness effect on texture and residual stress sign transition in sputtered TiN thin films

The Stress Properties of Oxide Thin Films Prepared by Reactive Electron Beam Evaporation

Stress Analysis of Mo, MoSi 2 and Si Mono-Layer Thin Films and Multilayers Prepared by Magnetron Sputtering

Evaluating Interface Effect On Stresses In Thin Films By A Local Curvature Metrology With High Accuracy And Resolution

Effects Of Target-Substrate Distance On Structure And Residual Stress Of Cu/Si(100) Thin Films

Theoretical Model of Thermal Stress in the Film-Substrate System of Optical Thin Film

Effect of Substrate Constraint on Stress-Induced Deformation Mechanism of Tungsten Thin Film

Finite Element Analysis of Stress in Contacting Zone of Film and Substrate

INVESTIGATION OF THE STRESS OF SiO2 FILMS DEPOSITED ON SAPPHIRE SUBSTRATE

Analysis of Thermal Stress in Vanadium Dioxide Thin Films by Finite Element Method