Anelastic Internal Friction and Mechanical Spectroscopy of SiO2/Si Wafers
Yurii Onanko,Lyudmyla Kuzmych,Anatoliy Onanko,Peter Il’in,Anna Kuzmych,Yurii Anatoliyovich Onanko,Anatoliy Petrovich Onanko,Peter Petrovich Il'in
DOI: https://doi.org/10.1149/2162-8777/ad36e0
IF: 2.2
2024-03-23
ECS Journal of Solid State Science and Technology
Abstract:In this work, after electron irradiation and X-ray, the outcomes of the evaluation dynamic characteristics of interstitial atoms Si j , vacancy V, and O-complexes were evaluated to account for the annealing conditions to derive specific structural defects in the SiO 2 /Si wafer. A non-destructive method, which allows the determination of the internal friction difference ΔQ -1 /Q -1 0 of the elastic vibration of structural defects of dislocations with density N D and the depth of the broken layer h b , is offered for the SiO 2 /Si wafer. The method was developed, the installation was designed and manufactured for the excitation and registration of damped bending resonant oscillations in a SiO 2 /Si disc-shaped wafer with a thickness h SiO 2 ≈ 100 nm, h is = 300÷500×10 3 nm, and diameter D = 60÷100×10 -3 m to measure the structurally sensitive internal friction Q -1 in vacuum P ≈ 10 -2 Pa. Measurement of the internal friction background Q -1 0 at harmonic frequencies f 0 and f 2 allowed us to experimentally determine the nodal lines of the oscillating disks.
materials science, multidisciplinary,physics, applied