Viscoelasticity finite element analysis of interface bonding behaviors of asphalt pavement

Nai-sheng GUO,Feng SHI,Ying-hua ZHAO,Yi-qiu TAN

DOI: https://doi.org/10.16411/j.cnki.issn1006-7736.2009.04.004

2009-01-01

Abstract:To analyze interface bonding behaviors of semi-rigid base asphalt pavement, the shear stress distribution between asphalt layer and base under different interfacial contact conditions was studied, then a suppositional interlayer inserted as practical engineering applied one was taken into account, moreover interfacial shear force as an indicator used to characterize the relation with time quantitatively, and the effects of interlayer with weak bonding and its parameters on interface bonding behaviors were analyzed as well by using three-dimensional finite element model based on viscoelasticity mechanics. Results indicate that the interfacial shear stress decreases with the decrease of the interfacial friction coefficient, and shear stress value along the road breadth direction (longitude) is bigger, comparing with traffic direction (latitude), furthermore, shear stress appears catastrophic where the discontinuity of interlayer exists. The latitude interface shear force increases and the longitude interface shear force decreases with time increasing while the suppositional interlayer is inserted into the model. Then the shear forces expands around the weak bonding, and the maximum shear force value rises to a certain extent due to the interlayer with weak bonding, moreover, the maximum shear force value increases as well as compressive modulus and thickness of interlayer increasing. The analysis shows that longitude interface shear force has considerable influence on the mechanics response of the pavement,therefore the resistance to the interfacial shear deformation between asphalt layer and base should be an important index in the design of asphalt pavement, and bonding interlayer should be set up to improve the contact conditions, and appropriate measures should be adopted to remove the weak bonding and optimize the design parameters of interlayer.