Thermal analysis and testing of multi layer ceramic-metal packaged LED

Jin Peng,Zhou Qifeng,Wu Na,Zhong Qun
DOI: https://doi.org/10.1109/ICEPT.2009.5270774
2009-01-01
Abstract:We studied the thermal properties LED light unit composed of nine LED chips in a MLCMP (multi-layer ceramic-metal package) and compared various thermal dynamic models. We concluded that the direct measurement of forward voltage Vf is the most practical approach for in-situ testing. By calibrating the Vf to junction temperature Tj at various forward current in a temperature controlled oven, the linear relationship of V f with respect to Tj was obtained and coefficient β was accurately extracted from experimental data. ©2009 IEEE.
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