Thermal Resistance Evaluation of High Power LED

Chang-bo ZHOU,Ke-yuan QIAN,Yi LUO
DOI: https://doi.org/10.16818/j.issn1001-5868.2009.01.010
2009-01-01
Abstract:A novel method for thermal resistance evaluation of high power LED is proposed. The junction temperature of LED chip is obtained by forward voltage method. The temperature of solder point of LED lamp is obtained through curve fitting of the dropping temperature after shutting. The difference of the two represents the thermal resistance of the LED. The proposed method avoids measuring the temperature of the solder point of the LED lamp, which is inevitable in common ways. The error introduced by contact thermal resistance is eliminated. The proposed method is more convenient, accurate and consistent. The proposed method is capable to evaluate the thermal resistance of surface mount LEDs (SMT-LEDs) which are difficult to test for common methods. Moreover, the method is capable to test the thermal resistance introduced by second time packaging.
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