Latest Advancement of Thermal Management for High Power LED

MA Lu,LIU Jing
DOI: https://doi.org/10.16818/j.issn1001-5868.2010.01.002
2010-01-01
Abstract:The temperature of the LED chip directly influences its light-emitting efficiency, working life and reliability. Through interpretation on thermoresistance of each component, several latest thermal management methods ranging from chip to system level for the high-power LED products are comprehensively reviewed, such as natural convective cooling, forced convective cooling based on piezoelectric fan and ionization approach, liquid cooling using water and liquid metal as coolant, two phase fluid cooling via heat pipe, solid cooling schemes with thermoelectric device and the heat recycle strategy using thermoelectric device to convert waste heat to electricity and thus power the active cooling system. On the basis of above-mentioned cooling schemes, several key problems in the thermal management of high power LED products are summarized.
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