INFLUENCE OF WORKING GAS ON STRUCTURES OF SILICON NITRIDE THIN FILMS

Zheng Xu,Xiaoyun Jia,Suling Zhao,Fujun Zhang,Yu Tang,Chunlan Zhou,Wenjing Wang
DOI: https://doi.org/10.3321/j.issn:0254-0096.2008.11.006
2008-01-01
Abstract:Silicon nitride thin films were prepared by radio frequency (r.f.) magnetron reactive sputtering with different Ar/N 2 flow ratio at 80°C temperature. The polished silicon wafers were used as the substrate materials in order to make surfaces of the sample smooth. The influence of working gas on structures and optical properties of silicon nitride thin films were studied. Comparisons of the optical properties of samples were made by reflection spectra in order to get a good way to reduce the reflectivity. From X-ray photoelectron spectroscopy (XPS) experiments, the bonding structure of Si-N appeared in the film which were confirmed by two peaks in standard binding enery. The atomic force microscope (AFM) images show that the films deposited on the silicon wafers were flat and compact. The experiment shows that some micropores and defects existed in the films accompanied with increasing of N 2 flow, which have a great impact on the properties of the films. And the content of SiNx in the films prepared in puried N 2 gas is higher than that deposited in the Ar/N 2 mixtures ambience.
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