Abstract:Semiconductors continue to shrink in die size because of benefits like cost savings, lower power consumption, and improved performance. However, this reduction leads to more defects due to increased inter-cell interference. Among the various defect types, customer-found defects are the most costly. Thus, finding the root cause of customer-found defects has become crucial to the quality of semiconductors. Traditional methods involve analyzing the pathways of many low-yield wafers. Yet, because of the extremely limited number of customer-found defects, obtaining significant results is difficult. After the products are provided to customers, they undergo rigorous testing and selection, leading to a very low defect rate. However, since the timing of defect occurrence varies depending on the environment in which the product is used, the quantity of defective samples is often quite small. Unfortunately, with such a low number of samples, typically 10 or fewer, it becomes impossible to investigate the root cause of wafer-level defects using conventional methods. This paper introduces a novel approach to finding the root cause of these rare defective chips for the first time in the semiconductor industry. Defective wafers are identified using rare customer-found chips and chip-level EDS (Electrical Die Sorting) data, and these newly identified defective wafers are termed vBADs (virtual bad wafers). The performance of root cause analysis is dramatically improved with vBADs. However, the chip-level analysis presented here demands substantial computing power. Therefore, MPP (Massive Parallel Processing) architecture is implemented and optimized to handle large volumes of chip-level data within a large architecture infrastructure that can manage big data. This allows for a chip-level defect analysis system that can recommend the relevant EDS test and identify the root cause in real time even with a single defective chip. The experimental results demonstrate that the proposed root cause search can reveal the hidden cause of a single defective chip by amplifying it with 90 vBADs, and system performance improves by a factor of 61.

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