Evolution of Intermetallic Compounds in SnAg and SnAgCu Lead-Free Solder Joints During Aging

LI Xiao-yan,YANG Xiao-hua,WU Ben-sheng,YAN Yong-chang

DOI: https://doi.org/10.3969/j.issn.1672-7207.2007.01.006

2007-01-01

Abstract:The types,morphology and distribution of intermetallic compounds (IMCs),and the evolution of the types and composition and morphology of IMC in the joints during the subsequent aging process were presented. The analysis results show that the types of IMCs mainly depend on solder composition and the solubility and diffusion rate of metal substrate in solder alloy;the morphology of IMC is closely related with the soldering peak temperature,cooling rate and the thermal gradient of the interface of joints;the distribution of IMC is related with solder composition and the diffusivity of metal elements in the joints.The analysis results also show that the fracture mechanism of the joints is mainly controlled by the solder composition,the peak temperature and duration of aging as well as the applied loads.The eutectic structures of the solder are coarsened during the aging process and the strength of the solder decreases,thus the fracture occurrs inside the solder.If the thickness of IMC increases to critical size,the stress concentration wil be serious. Some time multilayer IMCs will be formed and cavity will be formed and grow,and the fracture will occur in the interfacial layer of IMCs.If the strengths of the solder and IMC are close during aging,the fracture will occur both inside the joints and in the interfacial layer of IMCs.