Study on Cu nanowires by using in-situ high-temperature XRD

Quan CAI,Junxi ZHANG,Xing CHEN,Zhongjun CHEN,Wei WANG,Guang MO,Kunhao ZHANG,Tiandou HU,Zhonghua WU,Lide ZHANG
DOI: https://doi.org/10.3321/j.issn:0253-3219.2007.07.003
2007-01-01
Abstract:Cu nanowires with diameter of about 50 nm were electrochemically deposited in anodic alumina membrane. An in-situ high-temperature XRD technique was used to measure the crystalline structures. The results demonstrate that these Cu nanowires have a thermal expansion coefficient of about 2.6 × 10-5 K-1, which is a little larger than the bulk's one. These polycrystalline Cu nanowires are completely different from the zero-expansion Cu nanowires reported in previous reference. It is concluded that the thermal expansion coefficient is dependent on the crystalline perfection in nanowires.
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