Structural Change of Ni–Cu Alloy Nanowires with Temperature Studied by in Situ X-ray Absorption Fine Structure Technique

Guang Mo,Weidong Cheng,Quan Cai,Wei Wang,Kunhao Zhang,Xueqing Xing,Zhongjun Chen,Zhonghua Wu

DOI: https://doi.org/10.1016/j.matchemphys.2010.01.055

IF: 4.778

2010-01-01

Materials Chemistry and Physics

Abstract:Ni–Cu alloy nanowire array, with uniform length and diameter, was well fabricated by using alternating current electrodeposition. Both X-ray diffraction and in situ heating extended X-ray absorption fine structure technique were employed to characterize its structural change with temperature. As expected, a weak concentration fluctuation of Ni and Cu atoms was found in the as-prepared nanowires. However, this concentration fluctuation can be easily eliminated by heating the as-prepared sample at 200°C, which resulting in an approximately homogeneous Ni–Cu solid solution. From the nanostructural point of view, the serviceability temperature of Ni–Cu alloy nanowire array in magnetism could not exceed 200°C. The Ni–Ni, Ni–Cu and Cu–Cu bonds were found to have different thermal expansion behaviors, causing the distortion of the crystal cell. An average thermal expansion coefficient (1.1×10−5K−1) was obtained. The structural change of Ni–Cu alloy nanowires with temperature was discussed.