Mechanically-compensated bending-strain measurement of multilayered paper-like electronics via surface-mounted sensor
Furong Chen,Chao Hou,Shan Jiang,Chen Zhu,Lin Xiao,Hong Ling,Jing Bian,Dong Ye,YongAn Huang
DOI: https://doi.org/10.1016/j.compstruct.2021.114652
IF: 6.3
2021-12-01
Composite Structures
Abstract:Paper-like electronics with thin multi-layer structures, which can be repeatedly bent and twisted like paper, are promising for diverse innovation application. Employing surface-mounted flexible strain sensors is a general way to monitor the bending characteristics of each layer inside paper-like electronics, however, the deviation of measured strain will reach up to 15% on account of the layer-to-layer interface sliding, neutral axes offset resulted from the extra effect of the flexible strain sensor. Here, we proposed a precise measurement method to evaluate the surface bending strain of paper-like electronics by using flexible sensors. In combination with the effects of the thickness, length, etc, a strain compensation model has been established to compensate the measurement deviation. Meanwhile, a slip failure model has been developed to guide the design of the sensitivity unit within the non-sliding area of the flexible sensor. Validated by finite element analysis and experiment, the bending strain of paper-like electronics (eg., ∼50 μm) can be evaluated much more accurate compared to the frequent access one. The newly-proposed method provides a powerful basis for further research of paper-like electronics.
mechanics,materials science, composites