Abstract:Infrared detection signifies crucial and indispensable applications in numerous scenarios. Focal plane arrays (FPAs), the most vital devices in an infrared measurement system, are hindered by the incompatibility of the complementary metal oxide semiconductor (CMOS) integrated circuits and the photodetector fabrication process. In this report, a modified read-out circuit controlled by a microcontroller unit (MCU) is designed and fabricated to obtain signal outputs of FPA pixels using the multiplexing structure. The topological configuration of the connection between FPAs and the read-out circuit is explored, in addition, the principle of inter-pixel interference is elaborated. Feedback is delicately constructed in the modified read-out circuit to minimize the interference, which is overlooked in the previous work. To clarify the practical application of the modified read-out circuit, a PbSe FPA is prepared with microfabrication technologies and used to obtain 2-D mid-infrared (MIR) images of a heated target in real-time. The imaging results show apparent enhancement in contrast as we expect, which means that the inter-pixel interference is effectively reduced with our modified circuit. Thus, a good capability of anti-noise shows up in our photodetection measurement system, resulting in higher image quality. The modified read-out circuit can be further used in measurements comprised of various small-scale FPA chips with low fabrication costs.

A TDI CMOS readout circuit for IRFPA with linearity improvement

A Cmos Tdi Readout Circuit For Infrared Focal Plane Array

288X4 Time Delay and Integration Readout Ic for Infrared Focal Plane Array

288×4 IRFPA ROIC with TDI

A high efficient analog charge delay line for high performance CMOS readout integrated circuits with TDI function

Imaging of the Mid-Infrared Focal Plane Array with a Modified Read-Out Circuit.

A 64×4 IRFPA Readout IC with Low Parasitic Capacitance Effect

A Low Power High Linearity Cryogenic Readout Integrated Circuit with Large Charge Handling Capacity for 10 mu m Pitch 640x512 Infrared Focal Plane Array

A multichannel readout integrated circuit with column-wise pseudo differential extended counting ADCs for an uncooled infrared focal plane array based on silicon diodes

A Low Power High Linearity Cryogenic Readout Integrated Circuit with Large Charge Handling Capacity for <tex>$10\mu\mathrm{m}$</tex> Pitch <tex>$640\times 512$</tex> Infrared Focal Plane Array

A Novel Low-Power Readout Structure with 1/2 Sub-Scan Time-Delay-integration and DLL-based A/D for 1024×6 Infrared Focal Plane Array

A Low Power High Speed Readout Circuit for 320×320 IRFPA

The Design of a Low-Noise, High-Speed Readout-Integrated Circuit for Infrared Focal Plane Arrays

A Low-Noise CTIA-based Pixel with CDS for SWIR Focal Plane Arrays

Theoretical Investigation on Input Properties of DI and CTIA Readout Integrated Circuit

A CMOS Correlated Double Sampling Structure for the Readout Circuit of IRFPA

Design of Readout IC for Photoelectron Detector of Short-Wave High Frequency IRFPA

High Frame Rate High Precision ROIC with Pixel-level CCO-Based ADC for Infrared FPAs.

An Event-Driven High-Speed Imaging and Trace Detection ROIC for Cryogenic Infrared FPAs

Two‐stage ADC‐based ROICs for 25 Μm‐pitch Cryogenic Infrared Focal Plane Array

A Novel Cmos Readout Circuit For Large Format Irfpa With Background Current Storage Suppression