288X4 Time Delay and Integration Readout Ic for Infrared Focal Plane Array

Chen Zhongjian,Lu Wengao,Zhang Yacong,Ji Lijiu
IF: 1.019
2008-01-01
Chinese Journal of Electronics
Abstract:A new structure of 288x4 CMOS Time delay and integration (TDI) readout integrated circuit is presented in this paper. The TDI function is implemented using an integration and storage circuit array and a charge amplifier with the advantages of low power and compact layout. An experimental chip has been designed and fabricated in a 0.5 mu m double-poly-three-metal CMOS technology. The bi-directional TDI, defective element deselection and two-gain option (1.015pC/2.03pC) functions have been realized in the experimental chip and the measurement results at liquid nitrogen temperature indicated that all functions were correct and the performance has satisfied the requirement of long waveform IRFPA. The readout speed of each output can reach 5MHz and the dynamic range is 75.6dB.
What problem does this paper attempt to address?