Abstract:The performance of microfluidic chip mold is subject to the adhesion strength between electroform-ing layer and substrate in micro-electroforming process. In order to remedy this defect, a novel, lithograph-based method combining through-mask electrochemical etching and micro-electroforming is presented, by which the nickel double cross microfluidic chip mold with high adhesion has been successfully fabricated. According to experimental studies on process parameters, not only optimal parameters were yielded, but also issues like the failure of interfacial delamination due to pickling and lateral corrosion caused by electrochemical etching were further solved. The interface adhesion strength can be determined by shearing strength between electroforming layer and substrate so that the influence of pickling and etch-ing on interfacial adhesion strength can be analyzed quantitatively. The results of the experiments indicate that the shearing strength after pickling (25℃, 20s) and etching(30℃, 5min) is increased by 98.5％ and 203.6％ respectively, compared with that of untreated samples. Furthermore, the shearing strength of samples etched is 53.0％ higher than that of samples after pickling treatment. The method presented in this paper can effectively improve the adhesion strength between the electro-forming layer and the substrate. Additionally, the service life of microfluidic chip mold can be prolonged.The performance of microfluidic chip mold is subject to the adhesion strength between electroform-ing layer and substrate in micro-electroforming process. In order to remedy this defect, a novel, lithograph-based method combining through-mask electrochemical etching and micro-electroforming is presented, by which the nickel double cross microfluidic chip mold with high adhesion has been successfully fabricated. According to experimental studies on process parameters, not only optimal parameters were yielded, but also issues like the failure of interfacial delamination due to pickling and lateral corrosion caused by electrochemical etching were further solved. The interface adhesion strength can be determined by shearing strength between electroforming layer and substrate so that the influence of pickling and etch-ing on interfacial adhesion strength can be analyzed quantitatively. The results of the experiments indicate that the shearing strength after pickling (25℃, 20s) and etching(30℃, 5min) is increased by 98.5％ and 203.6％ respectively, compared with that of untreated samples. Furthermore, the shearing strength of samples etched is 53.0％ higher than that of samples after pickling treatment. The method presented in this paper can effectively improve the adhesion strength between the electro-forming layer and the substrate. Additionally, the service life of microfluidic chip mold can be prolonged.

Research on fabrication of micro-mould based on MEMS technology

Micro Hot Embossing Metal Mold For Microfluidic Chip Based On No Back Plate Growing Method

Metal Microstructure Microfabrication Technique

Multi-layer Microstructure Fabrication by Combining Bulk Silicon Micromachining and UV-LIGA Technology

Design and fabrication of MEMS devices using the integration of MUMPs, trench-refilled molding, DRIE and bulk silicon etching processes

Fabrication of High-Density Micro Column Chip Mould Using Micro Electroforming Technology Assisted by Megasonic Field and Electrochemical Etching

Route to one-step microstructure mold fabrication for PDMS microfluidic chip

Modeling and Micro-Milling Experiments on Complex 3d Micro-Mould Parts

A simple method for producing freestanding 3D microstructures by integrated photomask micromolding

A novel method for fabricating polydimethylsiloxane microfluidic chip master molds

Fabrication of 2D silicon nano-mold by side etch lift-off method

TECHNOLOGY OF SILICON-BASED MEMS

Using Silicon Molds for Ultrasonic Embossing on Polymethyl Methacrylate (PMMA) Substrates

Novel 3-D Device Fabrication Process in Micro-Electronic Mechanical System Based on Nano-Imprint Lithography

Fabrication of PDMS micro through-holes using micromolding in open capillaries

Progress in Microforming

DEM technique: A new three-dimensional micro fabrication technique for non-silicon materials

Fabrication of Microfluidic Chip Mold Based on Electrochemical Etching and Micro-Electroforming

Design and Optimization of Molding Process for MEMS WLSCP

Manufacturing of a Compact Micro Air Bearing Device for Power Micro Electro Mechanical System (MEMS) Applications Using Silica Film Assisted Processing

The Application and Research of Micro-Machining Technology for Manufacturing Micro-Mold