Fabrication of High-Density Micro Column Chip Mould Using Micro Electroforming Technology Assisted by Megasonic Field and Electrochemical Etching

Bingjiang Guo,Liqun Du,Shuai Wang,Changhao Wu,Zhongmin Wang,Mingxin Yu

DOI: https://doi.org/10.1016/j.cej.2024.153449

IF: 15.1

2024-01-01

Chemical Engineering Journal

Abstract:In order to fabricate high-density micro column chip mould, this paper proposed a novel compound method, which adopted megasonic field and electrochemical etching to assisted micro electroforming technique. Micro column loss could be found due to the generation of hydrogen bubbles and the low adhesive strength between the micro column and the substrate. The proposed compound method were used to promote bubble release and improve the adhesive strength. Results of electrochemical testing and visual experiments demonstrated that megasonic field (1.7 MHz, 6 W/cm2) can effectively promoted the release of hydrogen bubbles in the process of micro electroforming. The mechanism of megasonic field to promote the bubble release is that the acoustic fluid provides agitation. Experimental results of electrochemical etching indicated that 15 V and 20 s were optimal parameters for etching. Besides, adhesive strength could be improved from 21.30 MPa to 106.51 MPa with megasonic field and etching. The mechanism of compound method to improve adhesive strength is to increase the contact area and the substrate roughness by etching. And megasonic promotes the formation of more binding sites. Finally, a mould without micro column loss was fabricated successfully using the proposed method. This study provides new sights into the electrochemical manufacturing of micro/nano structure.